Samsung Electro-Mechanics to receive a combined 3.7 trillion won investment from Tesla and NVIDIA to build AI chip substrate lines
Tesla (about 1.1 trillion won) and NVIDIA (about 2.6 trillion won) will jointly invest roughly 3.7 trillion won — around $2.7 billion — in Samsung Electro-Mechanics to build FC-BGA substrate lines, the next-generation packaging substrates for AI semiconductors. Samsung Electro-Mechanics has also signed a long-term FC-BGA supply agreement with Tesla and will build a dedicated line at its Sejong plant, supplying AI chips for Tesla vehicles and Optimus robots. FC-BGA substrates have become a new chokepoint in the AI supply chain; the joint bet by two industry heavyweights shows how critical advanced packaging capacity has become. (Sourcing is via industry reports cited by Sina Finance.)
SOURCES
- 36氪 AI2026-10-22 07:12